Coating composition(s)

ABSTRACT

Described herein in some examples is a heat dissipation coating composition for an electronic device, which can comprise: a transparent coating layer deposited on a surface of the electronic device, wherein the coating layer comprises: a heat absorber selected from the group consisting of silica aerogel, carbon nanotubes, carbon nanotube aerogel, graphene, graphene aerogel, and combinations thereof, a transparent resin selected from the group consisting of a polyacrylic resin, a polycarbonate resin, a cyclic olefin resin, an epoxy resin, a urethane resin, a silicone resin, a cyanoacrylate resin, a polyester resin, and combinations thereof, and a solvent; and a heat spreader layer deposited at least partially on top of the transparent coating layer or deposited on the surface of the electronic device adjacent to the transparent coating layer, wherein the heat spreader layer comprises: metallic or non-metallic particles selected from the group consisting of copper, aluminum, graphite, carbon nanotube, graphene on a metal, graphene, and combinations thereof.

BACKGROUND

Electronic devices such as desktop computers, laptop computers, mobilephones, handheld devices, printing devices, and other electronic devicestend to heat during use.

BRIEF DESCRIPTION OF THE DRAWINGS

Features of examples of the present disclosure will become apparent byreference to the following detailed description and drawings, in whichlike reference numerals correspond to similar, though perhaps notidentical, components. For the sake of brevity, reference numerals orfeatures having a previously described function may or may not bedescribed in connection with other drawings in which they appear.

FIG. 1 is a sectional view of an electronic device substrate coated witha heat dissipation coating composition according to an example;

FIG. 2 is a sectional view of an electronic device substrate coated witha heat dissipation coating composition according to another example;

FIG. 3 is a sectional view of an electronic device substrate coated witha heat dissipation coating composition according to another example;

FIG. 4 is a top view of an electronic device substrate coated with aheat dissipation coating composition according to an example;

FIG. 5 is a top view of an electronic device substrate coated with aheat dissipation coating composition according to an example;

FIG. 6 is a top view of a common synthetic graphite film;

FIG. 7 is a top view of a transparent coating layer in a heatdissipation coating composition according to an example; and

FIG. 8 is a flow diagram of a method of depositing a heat dissipationcoating composition on an electronic device according to an example.

DETAILED DESCRIPTION

Most electronic device(s) such as desktop computers, laptop computers,mobile phones, handheld devices, printing devices, and other electronicdevices tend to generate heat during normal use. This generation of heatcan be become excessive and as a result damaging to the device due tomany different reasons including dust inside the electronic device, anew component such as a hard drive added to the electronic device (theextra component can cause the power supply to work harder and generateextra heat), over time some cooling fans might slow down and wear outcausing a build-up of heat, and/or high ambient room temperature.

A common cause of overheating is the accumulation of dust inside theelectronic device. The electrical components in the device can generateheat and any fans inside the device can help move the air to keep thecomponents cooled to normal operating temperatures. Inadequate coolingcan cause excess heat to build up inside the device which can damagecomponents.

Heat buildup can cause problems for any electronic device. Generally,when temperatures inside the device rises above about 35° C., the riskof damaging important internal components can increases greatly.

Accordingly, a need exists for a heat dissipation coating compositionfor electronic devices that can absorb/spread heat such that overheatingof electronic devices is reduced or eliminated.

“Electronic device(s)” as described herein is/are not limited to and caninclude desktop computers, laptop computers, mobile phones, handhelddevices, and printing devices.

As used herein, “(s)” at the end of some terms indicates that thoseterms/phrases may be singular in some examples or plural in someexamples. It is to be understood that the terms without “(s)” may bealso be used singularly or plurally in many examples.

“Heat Dissipation,” as used herein, refers to a composition that canabsorb and/or distribute heat to thereby reduce heat emanating from anyelectronic device hot spots.

In some examples, described herein is a heat dissipation coatingcomposition for an electronic device comprising: a transparent coatinglayer deposited on a surface of the electronic device, wherein thecoating layer comprises: a heat absorber selected from the groupconsisting of silica aerogel, carbon nanotubes, carbon nanotube aerogel,graphene, graphene aerogel, and combinations thereof, a transparentresin selected from the group consisting of a polyacrylic resin, apolycarbonate resin, a cyclic olefin resin, an epoxy resin, a urethaneresin, a silicone resin, a cyanoacrylate resin, a polyester resin, andcombinations thereof, and a solvent; and a heat spreader layer depositedat least partially on top of the transparent coating layer or depositedon the surface of the electronic device adjacent to the transparentcoating layer, wherein the heat spreader layer comprises: metallic ornon-metallic particles selected from the group consisting of copper,aluminum, graphite, carbon nanotube, graphene on a metal, graphene, andcombinations thereof.

In some examples, the transparent coating layer fully coats the surfaceof the electronic device.

In some examples, the transparent coating layer fully coating thesurface of the electronic device has a thickness of about 1 μm to about100 μm, or from about 5 μm to about 75 μm, or from about 10 μm to about50 μm.

In some examples, the heat absorber is present in the transparentcoating layer in an amount of from about 10 wt % to about 70 wt % basedon the total weight of the transparent coating layer, or from about 15wt % to about 60 wt % based on the total weight of the transparentcoating layer, or from about 20 wt % to about 50 wt % based on the totalweight of the transparent coating layer, or less than about 70 wt %based on the total weight of the transparent coating layer, or less thanabout 60 wt % based on the total weight of the transparent coatinglayer, or less than about 50 wt % based on the total weight of thetransparent coating layer, or less than about 40 wt % based on the totalweight of the transparent coating layer, or at least about 10 wt % basedon the total weight of the transparent coating layer, or at least about20 wt % based on the total weight of the transparent coating layer, orat least about 30 wt % based on the total weight of the transparentcoating layer, or at least about 40 wt % based on the total weight ofthe transparent coating layer, or at least about 50 wt % based on thetotal weight of the transparent coating layer.

In some examples, the transparent resin is present in the transparentcoating layer in an amount of from about 5 wt % to about 50 wt % basedon the total weight of the transparent coating layer, or from about 10wt % to about 45 wt % based on the total weight of the transparentcoating layer, from about 15 wt % to about 40 wt % based on the totalweight of the transparent coating layer, or from about 20 wt % to about35 wt % based on the total weight of the transparent coating layer, orless than about 50 wt % based on the total weight of the transparentcoating layer, or less than about 40 wt % based on the total weight ofthe transparent coating layer, or less than about 30 wt % based on thetotal weight of the transparent coating layer, or less than about 20 wt% based on the total weight of the transparent coating layer, or atleast about 5 wt % based on the total weight of the transparent coatinglayer, or at least about 10 wt % based on the total weight of thetransparent coating layer, or at least about 15 wt % based on the totalweight of the transparent coating layer, or at least about 20 wt % basedon the total weight of the transparent coating layer, or at least about25 wt % based on the total weight of the transparent coating layer, orat least about 30 wt % based on the total weight of the transparentcoating layer, or at least about 35 wt % based on the total weight ofthe transparent coating layer, or at least about 40 wt % based on thetotal weight of the transparent coating layer, or at least about 45 wt %based on the total weight of the transparent coating layer.

In some examples, the solvent is selected from the group consisting ofketone-based solvents, ester-based solvents, alcohol-based solvents,amide-based solvents, ether-based solvents, a hydrocarbon-basedsolvents, and combinations thereof.

In some examples, the heat spreader layer is deposited to coat 50% orless of the top of the transparent coating layer.

In some examples, the heat spreader layer is deposited to coat at least50% of the top of the transparent coating layer.

In some examples, the heat spreader layer is deposited on the surface ofthe electronic device adjacent to the transparent coating layer spreaderlayer to coat 50% or less of the surface of the electronic device.

In some examples, the heat spreader layer has a thickness of about 0.01mm to about 0.5 mm, or from about 0.02 mm to about 0.4 mm, or from about0.025 mm to about 0.3 mm.

In some examples, described is an electronic device comprising the heatdissipation coating composition described above.

In some examples, described herein is a method of depositing a heatdissipation coating composition on an electronic device comprising:depositing a transparent coating layer on a surface of the electronicdevice, wherein the coating layer comprises: a heat absorber selectedfrom the group consisting of silica aerogel, carbon nanotubes, carbonnanotube aerogel, graphene, graphene aerogel, and combinations thereof,a transparent resin selected from the group consisting of a polyacrylicresin, a polycarbonate resin, a cyclic olefin resin, an epoxy resin, aurethane resin, a silicone resin, a cyanoacrylate resin, a polyesterresin, and combinations thereof, and a solvent; and depositing a heatspreader layer at least partially on top of the transparent coatinglayer or depositing the heat spreader layer on the surface of theelectronic device adjacent to the transparent coating layer, wherein theheat spreader layer comprises: metallic or non-metallic particlesselected from the group consisting of copper, aluminum, graphite,graphene on a metal, carbon nanotube, graphene, and combinationsthereof.

In some examples, the transparent coating layer fully coating thesurface of the electronic device has a thickness of about 1 μm to about100 μm, or from about 5 μm to about 75 μm, or from about 10 μm to about50 μm.

In some examples, the heat spreader layer has a thickness of about 0.01mm to about 0.5 mm, or from about 0.02 mm to about 0.4 mm, or from about0.025 mm to about 0.3 mm.

In some examples, the heat spreader layer is deposited to coat at least90% of the top of the transparent coating layer, or to coat at least 91%of the top of the transparent coating layer, or to coat at least 92% ofthe top of the transparent coating layer, to coat at least 93% of thetop of the transparent coating layer, or to coat at least 94% of the topof the transparent coating layer, or to coat at least 95% of the top ofthe transparent coating layer, or to coat at least 96% of the top of thetransparent coating layer, or to coat at least 97% of the top of thetransparent coating layer, or to coat at least 98% of the top of thetransparent coating layer, or to coat at least 99% of the top of thetransparent coating layer, or to coat 100% of the top of the transparentcoating layer.

Turning now to the figures:

FIG. 1 is a sectional view of an electronic device substrate coated witha heat dissipation coating composition according to an example. In FIG.1, an electronic device 100 with hot spots 105 are shown. The hot spotsin the electronic device can include but are not limited to the centralprocessing unit (CPU) or an integrated circuit (IC)/printed circuitboard (PCB). The heat 115 generated from the hot spots 105 can beabsorbed by a transparent coating layer 130 and heat spreader layers 125both of which are coated on top of a surface 120 of the electronicdevice. In this example, the surface 120 of the electronic device is onan opposite surface from the surface with the hot spots.

FIG. 2 is a sectional view of an electronic device substrate coated witha heat dissipation coating composition according to another example. InFIG. 2, an electronic device 100 with hot spots 105 are shown. The hotspots in the electronic device can include but are not limited to theCPU or an IC/PCB. The heat 115 generated from the hot spots 105 can beabsorbed by a transparent coating layer 230 deposited on top of heatspreader layers 225 both of which are coated on top of a surface 220 ofthe electronic device. In this example, the surface 220 of theelectronic device is on an opposite surface from the surface with thehot spots.

FIG. 3 is a sectional view of an electronic device substrate coated witha heat dissipation coating composition according to another example. InFIG. 3, an electronic device 100 with hot spots 105 are shown. The hotspots in the electronic device can include but are not limited to theCPU or an IC/PCB. The heat 115 generated from the hot spots 105 can beabsorbed by a transparent coating layer 330 deposited on top of asurface 320 of the electronic device. Heat spreader layers 325 can bedeposited on top of the transparent coating layer 330. In this example,the surface 320 of the electronic device is on an opposite surface fromthe surface with the hot spots.

FIG. 4 is a top view of an electronic device substrate coated with aheat dissipation coating composition according to an example. In FIG. 4,the top view of the examples shown in FIG. 1 and FIG. 2 is shown wherethe transparent coating layer 430 coats the surface 420 of theelectronic device. The heat spreader layers 425 are directly coated ontop of the surface 420 of the electronic device.

FIG. 5 is a top view of an electronic device substrate coated with aheat dissipation coating composition according to an example. In FIG. 5,the top view of the example shown in FIG. 3 is shown where thetransparent coating layer 530 coats the surface 520 of the electronicdevice. The heat spreader layers 525 are coated on top of thetransparent coating layer 530.

It is to be understood that the configurations described in FIGS. 1-5can be modified without affecting the functioning of the described heatdissipation coating composition. For example, the hot spots, thetransparent coating layer, and the heat spreader layer can be all on thesame surface.

FIG. 6 is a top view of a common synthetic graphite film 635. Thiscommonly used synthetic graphite film has heat dissipation propertiesbut this film is commonly black in color. The use of this layer resultsin production of an electronic device that has a black surface color.This can be limiting and not a target for many electronic devices.Further, the surface area of the synthetic graphite film is limited tothe available area of the electronic device on which the film can beapplied. In contrast with this common black colored synthetic graphitefilm, the heat dissipation coating composition described herein includetransparent coating layers, which can allow for wide use across manydifferent applications of electronic devices. Further, the surface areaof the transparent coating layer is higher than the common syntheticgraphite film due to the presence of silica nanoparticles in aerogel,carbon nanotubes, carbon nanotubes in aerogel, graphene nanoparticles,and combinations thereof.

In some examples, the size of the silica nanoparticles, carbonnanotubes, carbon, and graphene nanoparticles in the transparent coatinglayer is from about 1 nm to about 800 nm, or from about 10 nm to about500 nm, or from about 20 nm to about 100 nm, or from about 30 nm toabout 80 nm, or at least about 1 nm, or at least about 10 nm, or atleast about 50 nm, or at least about 100 nm, or at least about 150 nm,or at least about 200 nm, or at least about 500 nm, or at least about800 nm, or less than about 1000 nm, or less than about 800 nm, or lessthan about 500 nm, or less than about 400 nm, or less than about 300 nm,or less than about 200 nm, or less than about 100 nm, or less than about90 nm, or less than about 80 nm, or less than about 70 nm, or less thanabout 60 nm, or less than about 50 nm, or less than about 40 nm, or lessthan about 30 nm, or less than about 20 nm, or less than about 10 nm, orless than about 5 nm, or less than about 3 nm.

In some examples, the amount of the silica nanoparticles, carbonnanotubes, carbon, and graphene nanoparticles in the transparent coatinglayer is from about 1 wt % to about 70 wt % based on the total weight ofthe transparent coating layer, or from about 5 wt % to about 60 wt %based on the total weight of the transparent coating layer, or fromabout 10 wt % to about 50 wt % based on the total weight of thetransparent coating layer, or from about 15 wt % to about 45 wt % basedon the total weight of the transparent coating layer, or from about 20wt % to about 40 wt % based on the total weight of the transparentcoating layer, or at least about 1 wt % based on the total weight of thetransparent coating layer, or at least about 10 wt % based on the totalweight of the transparent coating layer, or at least about 20 wt % basedon the total weight of the transparent coating layer, or at least about30 wt % based on the total weight of the transparent coating layer, orat least about 40 wt % based on the total weight of the transparentcoating layer, or at least about 50 wt % based on the total weight ofthe transparent coating layer, or at least about 60 wt % based on thetotal weight of the transparent coating layer, or at least about 70 wt %based on the total weight of the transparent coating layer, or less thanabout 85 wt % based on the total weight of the transparent coatinglayer, or less than about 75 wt % based on the total weight of thetransparent coating layer, or less than about 65 wt % based on the totalweight of the transparent coating layer, or less than about 55 wt %based on the total weight of the transparent coating layer, or less thanabout 45 wt % based on the total weight of the transparent coatinglayer, or less than about 35 wt % based on the total weight of thetransparent coating layer, or less than about 25 wt % based on the totalweight of the transparent coating layer, or less than about 15 wt %based on the total weight of the transparent coating layer.

In some examples, carbon nanotubes can have high surface areas (e.g.,greater than about 1,085 m²/g), which can contribute to thermalradiation absorption/spreading in the transparent coating layer comparedto a common synthetic graphite film or other similar common film.

FIG. 7 is a top view of a transparent coating layer 730 in a heatdissipation coating composition according to an example. The transparentcoating layer 730 includes carbon nanotubes of various shapes.

FIG. 8 is a flow diagram of a method of depositing a heat dissipationcoating composition on an electronic device according to an example. Themethod can include depositing a transparent coating layer on a surfaceof the electronic device 810 and depositing a heat spreader layer atleast partially on top of the transparent coating layer or depositingthe heat spreader layer on the surface of the electronic device adjacentto the transparent coating layer 820.

In some examples, described herein is a heat dissipation coatingcomposition for an electronic device comprising: a transparent coatinglayer deposited on a surface of the electronic device, wherein thecoating layer comprises: a heat absorber selected from the groupconsisting of silica aerogel, carbon nanotubes, carbon nanotube aerogel,graphene, graphene aerogel, and combinations thereof, a transparentresin selected from the group consisting of a polyacrylic resin, apolycarbonate resin, a cyclic olefin resin, an epoxy resin, a urethaneresin, a silicone resin, a cyanoacrylate resin, a polyester resin, andcombinations thereof, and a solvent; and a heat spreader layer depositedat least partially on top of the transparent coating layer or depositedon the surface of the electronic device adjacent to the transparentcoating layer, wherein the heat spreader layer comprises: metallic ornon-metallic particles selected from the group consisting of copper,aluminum, graphite, graphene on a metal, carbon nanotube, graphene, andcombinations thereof.

In some examples, the transparent coating layer can comprise: a heatabsorber selected from the group consisting of silica aerogel, carbonnanotubes, carbon nanotube aerogel, graphene, graphene aerogel, andcombinations thereof; a transparent resin selected from the groupconsisting of a polyacrylic resin, a polycarbonate resin, a cyclicolefin resin, an epoxy resin, a urethane resin, a silicone resin, acyanoacrylate resin, a polyester resin, and combinations thereof; and asolvent.

In some examples, the thermal radiation coefficient of the transparentcoating layer is in the range of 0.9-0.98.

In some examples, the heat absorber is present in the transparentcoating layer in an amount of from about 10 wt % to about 70 wt % basedon the total weight of the transparent coating layer, or from about 15wt % to about 60 wt % based on the total weight of the transparentcoating layer, or from about 20 wt % to about 50 wt % based on the totalweight of the transparent coating layer, or less than about 70 wt %based on the total weight of the transparent coating layer, or less thanabout 60 wt % based on the total weight of the transparent coatinglayer, or less than about 50 wt % based on the total weight of thetransparent coating layer, or less than about 40 wt % based on the totalweight of the transparent coating layer, or at least about 10 wt % basedon the total weight of the transparent coating layer, or at least about20 wt % based on the total weight of the transparent coating layer, orat least about 30 wt % based on the total weight of the transparentcoating layer, or at least about 40 wt % based on the total weight ofthe transparent coating layer, or at least about 50 wt % based on thetotal weight of the transparent coating layer.

In some examples, the transparent resin is present in the transparentcoating layer in an amount of from about 5 wt % to about 50 wt % basedon the total weight of the transparent coating layer, or from about 10wt % to about 45 wt % based on the total weight of the transparentcoating layer, from about 15 wt % to about 40 wt % based on the totalweight of the transparent coating layer, or from about 20 wt % to about35 wt % based on the total weight of the transparent coating layer, orless than about 50 wt % based on the total weight of the transparentcoating layer, or less than about 40 wt % based on the total weight ofthe transparent coating layer, or less than about 30 wt % based on thetotal weight of the transparent coating layer, or less than about 20 wt% based on the total weight of the transparent coating layer, or atleast about 5 wt % based on the total weight of the transparent coatinglayer, or at least about 10 wt % based on the total weight of thetransparent coating layer, or at least about 15 wt % based on the totalweight of the transparent coating layer, or at least about 20 wt % basedon the total weight of the transparent coating layer, or at least about25 wt % based on the total weight of the transparent coating layer, orat least about 30 wt % based on the total weight of the transparentcoating layer, or at least about 35 wt % based on the total weight ofthe transparent coating layer, or at least about 40 wt % based on thetotal weight of the transparent coating layer, or at least about 45 wt %based on the total weight of the transparent coating layer.

In some examples, the solvent is selected from the group consisting ofketone-based solvents, ester-based solvents, alcohol-based solvents,amide-based solvents, ether-based solvents, a hydrocarbon-basedsolvents, and combinations thereof. The solvent is present in thetransparent coating layer in an amount of from about 10 wt % to about 70wt % based on the total weight of the transparent coating layer, or fromabout 20 wt % to about 60 wt % based on the total weight of thetransparent coating layer, or from about 30 wt % to about 50 wt % basedon the total weight of the transparent coating layer, or less than about70 wt % based on the total weight of the transparent coating layer, orless than about 60 wt % based on the total weight of the transparentcoating layer, or less than about 50 wt % based on the total weight ofthe transparent coating layer, or less than about 40 wt % based on thetotal weight of the transparent coating layer, or less than about 30 wt% based on the total weight of the transparent coating layer, or lessthan about 20 wt % based on the total weight of the transparent coatinglayer, or at least about 10 wt % based on the total weight of thetransparent coating layer, or at least about 20 wt % based on the totalweight of the transparent coating layer, or at least about 30 wt % basedon the total weight of the transparent coating layer, or at least about40 wt % based on the total weight of the transparent coating layer, orat least about 50 wt % based on the total weight of the transparentcoating layer, or at least about 60 wt % based on the total weight ofthe transparent coating layer, or at least about 70 wt % based on thetotal weight of the transparent coating layer.

In some examples, the transparent coating layer can includeplasticizer(s), flow promoter(s), surfactant(s), release agent(s),flatting agent(s), coloring agent(s), wetting agent(s), waxingredient(s), silicone based polymer ingredient(s) (e.g.,polydimethylsiloxane (PDMS)), matting agent(s), co-solvent(s), orcombinations thereof.

In some examples, the heat spreader layer can comprise: metallic ornon-metallic particles selected from the group consisting of copper,aluminum, graphite, graphene on a metal, carbon nanotube, graphene, andcombinations thereof.

In some examples, the heat spreader layer can include the transparentresin and the solvent described above for the transparent coating layer.

In some examples, the heat spreader layer can include a non-transparentresin and a solvent selected from the group consisting of ketone-basedsolvents, ester-based solvents, alcohol-based solvents, amide-basedsolvents, ether-based solvents, a hydrocarbon-based solvents, andcombinations thereof. A non-transparent resin can include but is notlimited to polyvinyl acetate or polyvinyl chloride.

The heat spreader layer can further include plasticizer(s), flowpromoter(s), surfactant(s), release agent(s), flatting agent(s),coloring agent(s), wetting agent(s), wax ingredient(s), silicone basedpolymer ingredient(s) (e.g., polydimethylsiloxane (PDMS)), mattingagent(s), co-solvent(s), or combinations thereof.

In some examples, described herein is a method of depositing a heatdissipation coating composition on an electronic device comprising:depositing a transparent coating layer on a surface of the electronicdevice, wherein the coating layer comprises: a heat absorber selectedfrom the group consisting of silica aerogel, carbon nanotubes, carbonnanotube aerogel, graphene, graphene aerogel, and combinations thereof,a transparent resin selected from the group consisting of a polyacrylicresin, a polycarbonate resin, a cyclic olefin resin, an epoxy resin, aurethane resin, a silicone resin, a cyanoacrylate resin, a polyesterresin, and combinations thereof, and a solvent; and depositing a heatspreader layer at least partially on top of the transparent coatinglayer or depositing the heat spreader layer on the surface of theelectronic device adjacent to the transparent coating layer, wherein theheat spreader layer comprises: metallic or non-metallic particlesselected from the group consisting of copper, aluminum, graphite,graphene on a metal, carbon nanotube, graphene, and combinationsthereof.

The methods of depositing the transparent coating layer and the heatspreader layer can include but are not limited to gas phase methods andapplication methods, and the gas phase methods include physical methodssuch as a vacuum deposition method, sputtering method and the like, andchemical methods such as a chemical vapor deposition (CVD) method andthe like, and the application methods include a roll coat method,gravure coat method, slide coat method, spray method, immersion methodand screen printing method, and the like.

Some benefits of the heat dissipation coating composition describedherein can include but are not limited to achieving reduced electronicdevice temperatures, extending lifetime of electronic device componentsas a result of heat dissipation, increasing thermal radiationdissipation compared to graphite film or graphene film due to highsurface area of silica nanoparticles, carbon nanotubes, carbon, andgraphene nanoparticles, resolving or reducing electronic device hot spotissues, reducing the risk of battery explosion due to electronic deviceoverheating, preventing or reducing user injury due to hot spots,achieving reduction or elimination of hot spots thereby allowingfan-less electronic devices, improving information loading speed andpower efficiency, applying the heat dissipation coating compositionallows heat dissipation in irregularly shaped electronic device, andcombinations thereof.

Unless otherwise stated, any feature described hereinabove can becombined with any example or any other feature described herein.

In describing and claiming the examples disclosed herein, the singularforms “a,” “an,” and “the” include plural referents unless the contextclearly dictates otherwise.

It is to be understood that concentrations, amounts, and other numericaldata may be expressed or presented herein in range formats. It is to beunderstood that such range formats are used merely for convenience andbrevity and thus should be interpreted flexibly to include not just thenumerical values explicitly recited as the end points of the range, butalso to include all the individual numerical values or sub-rangesencompassed within that range as if each numerical value and sub-rangeis explicitly recited. As an illustration, a numerical range of “about 1wt % to about 5 wt %” should be interpreted to include not just theexplicitly recited values of about 1 wt % to about 5 wt %, but alsoinclude individual values and subranges within the indicated range.Thus, included in this numerical range are individual values such as 2,3.5, and 4 and sub-ranges such as from 1-3, from 2-4, and from 3-5, etc.This same applies to ranges reciting a single numerical value.

Reference throughout the specification to “one example,” “someexamples,” “another example,” “an example,” and so forth, means that aparticular element (e.g., feature, structure, and/or characteristic)described in connection with the example is included in at least oneexample described herein, and may or may not be present in otherexamples. In addition, it is to be understood that the describedelements for any example may be combined in any suitable manner in thevarious examples unless the context clearly dictates otherwise.

Unless otherwise stated, references herein to “wt %” of a component areto the weight of that component as a percentage of the whole compositioncomprising that component. For example, references herein to “wt %” of,for example, a solid material such as polyurethane(s) or colorant(s)dispersed in a liquid composition are to the weight percentage of thosesolids in the composition, and not to the amount of that solid as apercentage of the total non-volatile solids of the composition.

If a standard test is mentioned herein, unless otherwise stated, theversion of the test to be referred to is the most recent at the time offiling this patent application.

All amounts disclosed herein and in the examples below are in wt %unless indicated otherwise.

While several examples have been described in detail, it is to beunderstood that the disclosed examples may be modified. Therefore, theforegoing description is to be considered non-limiting.

What is claimed is:
 1. An electronic device comprising a heatdissipation coating composition, wherein the heat dissipation coatingcomposition comprises: a transparent coating layer deposited on asurface of the electronic device, wherein the transparent coating layercomprises: a heat absorber selected from the group consisting of silicaaerogel, carbon nanotube aerogel, graphene aerogel, and combinationsthereof, a transparent resin selected from the group consisting of apolyacrylic resin, a polycarbonate resin, a cyclic olefin resin, anepoxy resin, a urethane resin, a silicone resin, a cyanoacrylate resin,a polyester resin, and combinations thereof, and a solvent; and a heatspreader layer deposited at least partially on top of the transparentcoating layer or deposited on the surface of the electronic deviceadjacent to the transparent coating layer, wherein the heat spreaderlayer comprises: metallic or non-metallic particles selected from thegroup consisting of copper, aluminum, graphite, carbon nanotube,graphene on a metal, graphene, and combinations thereof, wherein theheat spreader layer is deposited to coat 50% or less of the top of thetransparent coating layer; or wherein the heat spreader layer isdeposited on the surface of the electronic device adjacent to thetransparent coating layer spreader layer to coat 50% or less of thesurface of the electronic device.
 2. The electronic device of claim 1,wherein the transparent coating layer fully coats the surface of theelectronic device.
 3. The electronic device of claim 2, wherein thetransparent coating layer fully coating the surface of the electronicdevice has a thickness of about 1 μm to about 100 μm.
 4. The electronicdevice of claim 1, wherein the heat absorber is present in thetransparent coating layer in an amount of from about 10 wt % to about 70wt % based on the total weight of the transparent coating layer.
 5. Theelectronic device of claim 1, wherein the transparent resin is presentin the transparent coating layer in an amount of from about 5 wt % toabout 50 wt % based on the total weight of the transparent coatinglayer.
 6. The electronic device of claim 1, wherein the solvent isselected from the group consisting of ketone-based solvents, ester-basedsolvents, alcohol-based solvents, amide-based solvents, ether-basedsolvents, a hydrocarbon-based solvents, and combinations thereof.
 7. Theelectronic device of claim 1, wherein the heat spreader layer has athickness of about 0.01 mm to about 0.5 mm.
 8. A method of depositing aheat dissipation coating composition on an electronic device comprising:depositing a transparent coating layer on a surface of the electronicdevice, wherein the coating layer comprises: a heat absorber selectedfrom the group consisting of silica aerogel, carbon nanotube aerogel,graphene aerogel, and combinations thereof, a transparent resin selectedfrom the group consisting of a polyacrylic resin, a polycarbonate resin,a cyclic olefin resin, an epoxy resin, a urethane resin, a siliconeresin, a cyanoacrylate resin, a polyester resin, and combinationsthereof, and a solvent; and depositing a heat spreader layer at leastpartially on top of the transparent coating layer or depositing the heatspreader layer on the surface of the electronic device adjacent to thetransparent coating layer, wherein the heat spreader layer comprises:metallic or non-metallic particles selected from the group consisting ofcopper, aluminum, graphite, carbon nanotube, graphene on a metal,graphene, and combinations thereof, wherein the heat spreader layer isdeposited to coat 50% or less of the top of the transparent coatinglayer; or wherein the heat spreader layer is deposited on the surface ofthe electronic device adjacent to the transparent coating layer spreaderlayer to coat 50% or less of the surface of the electronic device. 9.The method of depositing a heat dissipation coating composition of claim8, wherein the transparent coating layer fully coating the surface ofthe electronic device has a thickness of about 1 μm to about 100 μm. 10.The method of depositing a heat dissipation coating composition of claim8, wherein the heat spreader layer has a thickness of about 0.01 mm toabout 0.5 mm.